MediaTek has officially introduced its latest flagship system-on-chip (SoC) called Helio X30. It is based on 10nm TSMC process.
The chipset offers up to 22% performance boost and up to 40% better power efficiency when compared with its16nm predecessor.
It makes use of CorePilot 4.0 technology includes intelligent task scheduling system, thermal management and user experience monitoring systems.
The CorePilot 4.0 is built on MediaTek’s Tri-CLuster processing architecture, which offers minimum, medium and maximum processor levels.
MediaTek Helio X30 Specifications
- Process: 10nm
- Apps CPU: 2x Cortex-A53 @ 2.5GHz + 4x Cortex-A53 @ 2.2GHz + 4x Cortex-A35 @ 1.9GHz
- GPU: PowerVR Series7XT Plus (800MHz)
- Memory: 4 x 16-bit LPDDR4X (supports maximum of 8GB) memory, 1866MHz, eMMC 5.1, UFS 2.1
- Display: 2560x 1600 WQXGA @ 60Fps, 1920 x 1080 FHD @ 120Fps, w/12 HW Blending Layer
- Sensor Processor: Cortex-M4 (420MHz)
- Camera: 16MP + 16MP @ 30Fps (Dual ISP) 14-bit Vision Processor @ 550 MHz
- Video Decode: 4Kx2K 10-bit @ 30Fps, H.264/265/VP9
- Video Encode: 4Kx2K @ 30Fps H.265 w/VP9
- Audio: 120dB SNR & -100dB THD (MT6337) Audio DSP, Cortex-M4 420 MHz
- Modem: LTE FDD/TDD R12, Cat. 10 with 3x DLC CA
- Connectivity: External 2 x2 11 ac, Integrated Wi-Fi 802.11ac GPS/Glonass/Beidou ANT+, BT/FM, VoLTE, ViLTE, Wi-Fi Calling, Ultra HD Voice (EVS), RCS. LTE-U/LWA bands.
The MediaTek Helio X30 is already under mass production. Devices running on X30 Deca-Core chipset will be available in Q2, 2017.