Huawei took to IFA 2017 event and announced its latest SoC called Kirin 970. It is an octa-core chipset consiting of four ARM Cortex-A73 cores (up to 2.4GHz) and four ARM-Cortex-A53 ones (Up to 1.8GHz).
Huawei has used TSMC’s 10nm process to make Kirin 970. It is also equipped with ARM Mali-G72MP12 GPU (12 cores) for graphics. The SoC features in TEE and inSE security engines.
The SoC is said to contain 5.5 billion transistors on a single square centimeter. Company claims that, its computing architecture offers 25 times the performance at 50 times better efficiency.
The Huawei Kirin 970 is also world’s first processor to feature dedicated Neural Processing Unit (NPU), bringing in on-device AI capabilities. The Chipset sports Dual SIM with motion detection, low light enhancements and supports 4-Hybrid Focus. It can record HDR10 videos and 4K videos at 60/30Fps.
The Kirin 970 is said to power Huawei Mate 10 smartphone, which is slated to go official on October 16th.
Richard Yu, CEO of HUAWEI Consumer Business Group, said:
As we look to the future of smartphones, we’re at the threshold of an exciting new era. Mobile AI = On-Device AI + Cloud AI. HUAWEI is committed to developing smart devices into intelligent devices by building end-to-end capabilities that support coordinated development of chips, devices, and the cloud. The ultimate goal is to provide a significantly better user experience. The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition.