Qualcomm at CES 2017, has finally released details about its Snapdragon 835 processor. It is company’s first processor that is based on 10nm FinFET technology.
It has four 2.45GHz Kyro 280 performance CPU’s and four 1.90GHz Kyro 280 Efficient CPU’s. It is backed by Qualcomm Adreno 540 GPU and supports OpenGL ES 3.2, OpenCL 2.0 full, Vulkan and DX12.
The Qualcomm Snapdragon 835 features Hexagon 682 DSP with Hexagon Vector eXtensions and Qualcomm All-Ways Aware technology, TensorFlow and Halide support, Snapdragon Neural Processing Engine (NPE) SDK.
It supports UFS 2.1 Gear3 2L, SD 3.0 (UHS-I) and LPDDR4X (1866MHz) dual-channel memory. It is integrated with X16 LTE model with Global Model.
The Chipset can deliver speeds of up to 1Gbps down / 150 Mbps up (Cat16/13) via 4×20 MHz carrier aggregation. It offers up to 256-QAM downlink, Qualcomm Snapdragon Upload+, 2×20 MHz carrier aggregation and up to 64-QAM uplink.
The Snapdragon 835 SoC allows LTE Dual SIM Dual Standby, VoLTE with SRVCC to 3G and 2G HD and Ultra HD Voice (EVS). It also supports CSFB to 3G and 2G.
The Snapdragon All Mode brings support for all seven cellular modes plus LTE-U and LAA. It has Qualcomm TruSignal with carrier aggregation as well.
The Chipset supports up to 16MP dual cameras or upt o 32MP single camera. It has Qualcomm Spectra Image SEnsor processor (14-bit dual-ISP) and bring in camera features like Clear Sight, Hybrid Auto Focus, Optical Zoom, HDR Video Recording and hardware-accelerated face detection.
Apart from that, the SoC supports 802.11ad Multi-gigabit, Integrated 802.11ac 2×2 with MU-MIMO, 2.4 GHz, 5 GHz and 60 GHz, Bluetooth 5.0, NFC, Qualcomm Location, Supports GPS, Glonass, BeiDou, Galileo, and QZSS systems content protection.
To end it, Qualcomm Quick Charge 4 is supported as well.
Devices powered by Qualcomm Snapdragon 835 will be available in first half of 2017.