LG Electronics has confirmed that it has teamed up with Infineon Technologies AG to bring its leading edge Time-of-Flight (ToF) technology in its upcoming LG G8 ThinQ smartphone.
For those who aren’t aware, Infineon is a German chip maker, who is world’s leading manufacturer of power semiconductors and is also recognized for its technological excellence in Sensor solutions.
The G8 ThinQ front camera (selfie camera) will feature in Infineon’s REAL3 image sensor chip. It will leverage combined expertise of Infineons and pmdtechnologies algorithms for processed 3D point clouds, which are a set of data points produced by 3D scanning.
This ToF image sensor chip in front camera will also deliver more accurate measurements by capturing Infrared light as it is reflected from subject. The makes the ToF snapper faster and more effective than ambient light.
The LG G8 ThinQ’s ToF camera has fast response speed and will also be used for biometric authentication. It delivers excellent face recognition both in indoors and outdoors and will be ideal for implementation in AR and VR applications.