Mediatek has take wraps of its latest Dimensity 1050 5G SoC which is company’s first chipset to feature mmWave 5G for 5G smartphones. Along with it, MediaTek has also announced Dimensity 930 5G SoC and Helio G99 4G chipsets for mobiles.
MediaTek Dimensity 1050 specs
The SoC is based on TSMC 6nm process. It comes with total of eight cores making up of 2.5GHz Cortex-A78 x 4 + 2GHz Cortex-A55 x 4 CPU’s. It comes with ARM Mali-G610 MC3 GPU.
The Dimensity 1050 SoC supports LPDDR5 and LPDDR4X RAM and allows UFS 2.1 and UFS 3.1 storage. It comes support for resolution of up to 2520 x 1080 pixels (FHD+) at 21:9 aspect ratio and 144Hz refresh rate.
For optics, the chipset handles 20MP+20MP, 108MP, Dual HDR video capture hardware 3X HDR-ISP MFNR 3DNR AINR Hardware Depth Engine Warping Engine. It allows video playback / encode with H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC codecs.
In terms of connectivity, the MediaTek Dimensity 1050 brings support for Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM. It has SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback.
Other features include Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC, FM Radio.
Mobile phones houses MediaTek Dimensity 1050 SoC will launch some time in Q3 2022.
MediaTek Dimensity 930 specs
It is a TSMC 6nm based MediaTek SoC that supports 2520 x 1080 pixels FHD+ resolution, 21:9 aspect ratio and 120Hz refresh rate.
The Dimensity 930 5G SoC comes with True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback.
The SoC has 2.2GHz Cortex-A78 x 2 + 2GHz Cortex-A55 x 6 (octa-core) CPU cores and is paired with IMG BXM-8-256 GPU. It supports LPDDR4x / LPDDR5 RAM and UFS 2.1 / UFS 2.2 / UFS 3.1 storage.
The Dimensity 930 easily handles 64MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine. For connectivity it has Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC.
Cell phones powering MediaTek Dimensity 930 SoC are expected in Q2 2022.
MediaTeK Helio G99 Specs
Unlike Helio G96, the Helio G99 is based on TSMC 6nm process. It has octa-cores (2.2GHz Cortex-A76 x 2 + 2Ghz Cortex-A55 x 6) paired with ARM Mali-G57 MC2 GPU.
It has support for displays with 2520 x 1080 pixels Full HD+ resolution at 21:9 aspect ratio and 120Hz refresh rate. In terms of memory, G99 SoC can easily handle 2X LPDDR4x Up to 2133MHz, eMMC 5.1 / UFS 2.2.
For cameras, the chipset supports 16MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction.
Connectivity features include Cat-13 DL, 4G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), 4G FDD / TDD, HSPA +, 4X4 MIMO, 2CC CA, 256QAM, TAS 2.0, HPUE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71, Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS / QZSS L1+ L5 / Galileo E1 + E5a / BeiDou B1C + B2a / NAVIC
Phones running with Helio G99 SoC are expected in Q3, 2022.