Xiaomi is working on its latest mobile phone named the Mi Max. It has made its way at TENAA, a Chinese certification authority. Company’s CEO Lei Jun has also teased the phones official image at weibo, further increasing the news credibility.
It has volume buttons on the right side coupled with power buttons and features metallic build. Fingerprint sensor sits on the back side for security. It has slim metal body with a curved glass screen on the front (as per TENAA).
According to the listing, Specifications of Xiaomi Mi Max notes a 6.4-Inch IPS display panel with 1920 x 1080 pixels full HD resolution and supports multi-touch as well.
A Hexa Core (1.8GHz Cortex-A72 x 2 + 1.4GHz Cortex-A53 x 4) Qualcomm Snapdragon 650 processor with Adreno 510 GPU sits inside. It should have 2GB RAM with 16GB storage and 3GB RAM with 32GB storage memory, both with options for further expansion.
It’s dual SIM slots will support 4G LTE with VoLTE. Rear camera is said to be of 16MP and sports Dual-Tone LED flash as well. On the front is 5MP selfie camera as well. Details on battery capacity are not available yet. Connectivity options include Wi-Fi 802.11 a/b/g/n/ac, Wi-Fi Hotspot, Dual Band (2.4/5GHz), Bluetooth V4.1, GPS/GLONASS, 3.5mm Audio Jack etc.
The Xiaomi Mi Max will launch at an event held on May 10, 2016 (Tuesday) where, official specifications and Pricing of this phablet smartphone will be revealed.
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