Samsung has started mass production of its first mobile application processor (AP) called Exynos 7 Dual 72720. It is specially designed for wearable devices and is made using 14nm FinFET process technology.
The Exynos 7 Dual 7270 features LTE modem integration and provides full connectivity, which is first in its class. It delivers 20% improvements in power efficiency when compared to its predecessor built on 28nm. The chip consists of two Cortex-A53 cores and full utilizes 14nm process. It has Cat4 LTE 2CA modem which allows wearable to connect with cellular services as stand alone device. Moreover, it is power efficient and is clamed to provide extended battery life.
The Exynos 7 Dual 7270 makes use of Samsung’s innovative packaging technology, SiP (system-in-package), ePOP (embedded package-on-package) that enables chipset to provide outstanding performance with improved power efficiency. The 14nm FinFET process combines the AP, DRAM and NAND flash memory chips as well as PMIC (power management IC) together into a single package.
It has 100-square-millimeter (mm2) area and has reduced height by about 30%. It offers more features than its predecessor. Moreover, The chipset also comes with embedded Wi-Fi, Bluetooth, supports FM Radio, location-based services with GNSS (global navigation satellite system) etc.
A reference platform consisting of Exynos 7270, NFC and various sensors is already available for customers and manufacturers.
Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics commented –
The Exynos 7270 presents a new paradigm for system-on-chips (SoC) dedicated to wearables. Designed on our state-of-the-art process technology, this AP offers great power savings, 4G LTE modem and full connectivity solution integration, as well as innovative packaging technology optimized for wearable devices. It is a ground-breaking solution that will greatly accelerate wider adoption of wearable devices by overcoming limitations in current solutions such as energy usage and design flexibility