HomeTechnologyMediaTek Dimensity 9000+ SoC announced - Key Specs

MediaTek Dimensity 9000+ SoC announced – Key Specs

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MediaTek unveiled its Dimensity 9000 SoC back in November. Today, it has announced its latest flagship SoC called MediaTek Dimensity 9000+.

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The Dimensity 9000+ chipset is based on TSMC 4nm process technology. It has total of eight CPU cores which includes one Cortex X2 Ultra core clocked at 3.25GHz, three Cortex-A710 Super cores with 285GHz clock speeds and four 1.8GHz Cortex-A510 efficiency cores.

It comes with a boosted ARM Mali-G710 MC10 GPU. Statistically, the Dimensity 9000+ offers 5% CPU boost and 10% enhanced Graphic performance. It has support for LPDDR5X RAM (up to 7500mbps) which is 20% more efficient than standard LPDDR5.

The MediaTek Imagiq 790 on the chipet is a flagship 18-bit HDR-ISP that can record HDR video on three cameras simultaneously. It has incredibly power 9Gpixel/s ISP and supports 320MP camera for smartphones.

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The Dimensity 9000 Plus has MediaTek APU 590 which is a 5th Generation Ai Engine. It offers up to 4X power efficiency. The MediaTek MiraVision 790 brings latest HDR support. The SoC can easily handle WQHD+ resolution at 144Hz refresh rate and 1080p+ at 180Hz. It has support for Wi-Fi Display up to 4K60 HDR10+.

MediaTek Dimensity 9000+ SoC -2

MediaTek Dimensity 9000+ specifications

  • Process: TSMC N4 (4nm-class)
  • CPU 3.2GHz Cotex-X2 x 1 + up to 2.85GHz Cortex-A710 x 3 + Cortex-A10 x 4
  • GPU: ARM Mali-G710 MC10 GPU (with MediaTek HyperEngine 5.0)
  • APU: MediaTek APU 590
  • Display: 144Hz WQHD+ / 180Hz FullHD+, MediaTek Intelligent Display Sync 2.0, MediaTek MiraVision 790
  • Memory: LPDDR5X (up to 7500Mbps)
  • Camera: MediaTek Imagiq 790, 18-bit HDR-ISP Fusion up to 9Gpixel/s, Up to 320MP primary camera, 3-exposure HDR Videography
  • Audio: Bluetooth LE audio-ready technology with Dual-Link True Wireless Stereo Audio
  • Connectivity: Wi-Fi 6E 2×2 (BW160) and Bluetooth V5.0, Wi-Fi / Bluetooth hybrid coexistence design
  • Modem: 3GPP Release 16 5G modem, 5G NR 3CC Carrier Aggregation (300MHz) up to 7Gbps, Mediatek UltraSave 2.0, R16 UL Tx Switching from both SUL and NR UL-CA based connection, Dual SIM, Dual 4G/5G Active (DR-DSDA)
  • Customization: Dimensity 5G Open Resource Architecture ready

The Dimensity 9000+ SoC is expected to make into smartphones in Q3 2022.

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