MediaTek has officially unveiled its latest 5G SoC for smartphones called Dimensity 8000, Dimensity 8100 and Dimensity 1300.
MediaTek Dimensity 8000 and Dimensity 8100 – Key specs, features
For starters, both of these chipsets are based on 5nm TSMC process. These come with Dimensity 9000’s Imagiq 780 photo and video capture engine, HyperEngine 5.0 gaming enhancements, 5th Gen AI processor and Release-16 5G modem.
The MediaTek Dimensity 8100 comes with octa-core (2.85GHz Cortex-A78 x 4 + 2GHz Cortex-55 x 4) CPU cores. The MediaTek Dimensity 8000 on the other hand has octa-cores (2.75GHz Cortex-A78 x 4 + 2GHz Cortex-A55 x 4) CPU’s.
They come with ARM Mali-G610 MC6 GPU. These can handle quad-channel LPDDR5 (6400Mbps) memory and dual-channel UFS 3.1 storage. Both SoC’s support FHD+ resolution at 168Hz refresh rate and WQHD+ resolution at 120Hz.
In terms of cameras, these handle single 200MP, Simultaneous dual camera HDR video recording, 5Gbps 14-bit HDR-ISPs / Video HDR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD. These support H.264, HEVC, VP-9, AV1 / H.264, HEVC, 4K60 HDR10+ video playback / encoding.
The Dimensity 8000 / 8100 comes allows 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA. They also support 5G/4G Dual SIM Dual Standby, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC, 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback.
For connectivity, these support Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.3, GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC.
MediaTek Dimensity 1300 key features
The Dimensity 1300 is successor to last year’s Dimensity 1200 SoC. It is based on 6nm process technology and comes with Eigh-Cores. These make up of up to 3GHz Cortex-A78 x 1 ultra-core + Cortex-A78 x 3 super cores + Cortex-A55 x 4 efficiency cores.
The SoC houses ARM Mali-G77 MC9 GPU and includes MediaTek APU 3.0 to support AI capabilities. It has six-core APU 3.0 which offers 10% improvements in AI tasks. Apart from new AI Enhancements, it offers improved night shot photography, HDR capabilities.
The MediaTek Dimenity 1300 comes with HDR-ISP bringing support for up to 200MP. It includes MediaTek HyperEngine 5.0 for enhanced gaming enhancements and optimizations. Additionally, the SoC supports AI-VRS, Wi-Fi and Bluetooth Hybrid 2.0, Wireless earbud latency improvement and Dual-Link True Wireless Stereo Audio.
Smartphones powered by MediaTek Dimensity 8000, Dimensity 8100 and Dimensity 1300 which roll out in Q1 2022. Xiaomi has already confirmed that Redmi K50 series will use Dimensity 8100 SoC while the Relame GT Neo3 is expected to use same chipset.