MediaTek Helio P23 and Helio P30 chipsets announced

MediaTek has announced two new ‘P Series’ chipset called Helio P23 and Helio P30. Both of them feature octa-core Cortex-A53 processor architecture and comes with new features and batter IP Blocks.

These new chips are designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities. Both Helio P23 and Helio P30 are 64-bit octa-core processors consisting of 2.3GHz A53 x 4 + 1.65GHz A53 x 4. They are made on TSMC’s 16nm manufacturing process.

These new SoC’s include a powerful Mali-G71 GPU which a decent upgrade from Mali-T880 GPU found in Helio P20 / P25 SoC’s. The P23 and P30 SoC’s  now support dual VoLTE / ViLTE, allowing both SIM’s in smartphone to connect on LTE networks.

It features MediaTek’s latest Generation 4G LTE World Modem, with a unique combination of Cat-7/13 speeds of 300 mbit/s download and 150 mbit/s upload. TAS 2.0 smart antenna technology further enhances performance.

Both, the Helio P23 and Helio 30 support dual cameras, making them first among Helio lineup. They deliver hardware and software backed dual-camera features for superior photography. The P23 supports two 13MP cameras while the P30 is capable of handling 16 + 16MP cameras.

These chipsets also incorporates MediaTek’s Imaging 2.0 technology suite. It is uses to  minimize aliasing, grain and noise, reduce chromatic aberration etc. Moreover, it has Camera Control Unit (CCU)  as well, which is said to be twice as fast as competitors.

The Helio P30 specifically features a new Vision Processing Unit (VPU), a dedicated 500MHz digital signal processor paired to Image Signal processors. It allows Programmability and Flexibility, Huge Power reduction, Performance Boost (CPU/GPU) and deliver real time Bokeh.

MediaTek Helio P23 features

  • Dual 4G LTE DSDS with Dual VoLTE/ViLTE, 2×2 Carrier Aggregation; Low Power Design; TAS 2.0
  • Cat-6, Cat-7 DL / Cat-13 UL
  • Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), FDD / TDD LTE
  • Processor: Octa-Core 64-bit ARM Cortex-A53 processors (2.3GHz x 4 + 1.65GHz x 4) with Heterogeneous Multi-processing
  • LPDDR3 (Single Channel) (933MHz) with max up to 4GB, LPDDR4X (1600MHz) with max up to 6GB
  • eMMC 5.1 Storage
  • Graphics: ARM Mali-G71 MP2 GPU (770MHz max frequency), can display 2160 x 1080 pixels resolution
  • 13MP + 13MP dual camera (color + mono or wide + tele zoom) or 24MP single Camera ISP, 1080p vidoe recording at 30fps
  • Wi-Fi 802.11 a/b/g/n Bluetooth,  FM Radio
  • GPS, Glonass, Beidou, Galileo
  • CorePilot, EnergySMart Screen, Imagiq, MiraVision

MediaTek Helio P30 features

  • Dual 4G LTE with 2×2 Carrier Aggregation; Low Power Design; ETM 2.0; TAS 2.0Design; TAS 2.0
  • Cat-6, Cat-7 DL / Cat-13 UL
  • Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), FDD / TDD LTE, HSPA +
  • Processor: Octa-Core 64-bit ARM Cortex-A53 processors (2.3GHz x 4 + 1.65GHz x 4) with Heterogeneous Multi-processing
  • LPDDR4X (1600MHz) with max up to 6GB
  • eMMC 5.1, UFS 2.1 Storage
  • Graphics: ARM Mali-G71 MP2 GPU (950MHz max frequency), can display 2160 x 1080 pixels resolution
  • 16MP + 16MP dual camera (color+mono, wide+tele zoom with real-time depth engine) or 25MP single Camera ISP, CCU for Instant AE; VPU @ 500MHz; 24MP @ 30FPS, 3840 x 2160 resolution for recording.
  • Wi-Fi 802.11 a/b/g/n/ac Bluetooth,  FM Radio
  • GPS, Glonass, Beidou, Galileo
  • CorePilot, EnergySMart Screen, Imagiq, MiraVision

The MediaTek Helio P23 and Helio P30 chips will be available starting Q4 2017. The P30 chipset will initially be limited to Chinese markets.

 

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